Tadpole SPARCbook 3 series, Reference Manual

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Architecture Overview
1-3
Main Components
are fixed together. When the two boards are correctly assembled, the CPU
heatsink is brought into contact with the system’s magnesium base casting
to provide effective heat dissipation, as shown in Figure 1-1.
1.2.3 Microcontroller module
The microcontroller module is a small board which carries an Hitachi H8
microcontroller, the status display which is visible from the outside of the
assembled system, and a number of programmable memory devices. It
provides connections for the keyboard and pointing stick for which it
provides control and for the Base board for which it provides system
control and status monitoring functions.
1.2.4 Main display
The main display is housed within the system’s lid along with an inverter
board required to drive the display’s backlight. Systems use either 9.4 inch
640 x 480 or 10.4 inch 800 x 600 color TFT display to provide a sharp
image in a wide range of lighting conditions. The brightness of the
backlight is controlled by the microcontroller and can be varied to suit the
lighting conditions or can be dimmed or turned off when required to
conserve battery power.
1.2.5 Other components
In addition to the main boards and display, the SPARCbook 3 system
contains is a 2.5 inch 1.2 GB (or larger when available) SCSI hard disk
drive assembled within a removable module. The drive can be removed
from the SPARCbook 3 while the system is fully assembled, see your
SPARCbook 3 User Guide .
Figure 1-1 CPU Heat Dissipation
CPU Module
Base Board
System’s Magnesium
Base
CPU Heatsink
Inter-Board Connectors
S3GX_TRMBook Page 3 Friday, September 19, 1997 11:39 am