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SI1705004E-00=SIGMA-G5SII Service Manual
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1.4.5.12.
Machine Inside CPK Offset Teaching
Under each of the following conditions, this teaching is required.
It affects the placement accuracy directly.
The adjustment outside the company is simplified.
The offset teaching is to be performed when the machine is delivered.
The PEC recognition camera is to be changed.
X-axis or Y-axis linear scale and scale head are to be changed.
Required Jig and Tool
No
Name
Drawing No.
Jig No.
Q’ty
1
Self-Calibration Set
KYB-M8820-001
JG-0357
1
2
NOZZLE HG33C SET 15
KYA-M8C07-100
HG33C
1
3
ASSY GD-38083B
KYD-MC100-601
GD38083
1
Purpose (Machine Inside CPK Offset Teaching)
This function does not show the measurement results with the absolute standards like in
the CPK measuring machine, but shows the relative measurement results.
This offset is available when the component with the 0603 size or smaller, is placed.
Note:
If there is a request by the user for CPK measurement results not using the standard machine or for
speed reduction condition or placement with change of placement pattern, the external CPK
measurement machine is used as usual.
For the measurement, any support pin is not required.
When the size of a chip component to be placed by the user is 1005 or more, there is no problem
without measurement.
Applicable Machines
The machine should be the placement accuracy adjustment function only for the SIGMA-
G5S high-speed head type. The multi-functional head is not applicable (as of 2014/8). In
this case, the placement accuracy adjustment is performed with the CPK measurement
machine as usual.
The applicable machines are only following two types.
(1) High speed head - High speed head
(A-type)
(2) High speed head - Multi-functional head (D-type)
