For more information, see
Description of the PCBs, page 73
CNF menu, page 66
10.5.8 Screed drying with the aid of the heat pump
The screed drying program reduces the drying time of a freshly poured
screed floor.
The settings for these temperatures must follow the screed layer's rec
ommendations.
Activation of this function via the CP470 parameter (setting other than 0)
forces the permanent display of the screed drying function and deacti
vates all other control system functions.
When the screed drying function is active on one circuit, all other circuits
and the domestic hot water circuit continue to run.
It is possible to use the screed drying function on circuits A and B. The
parameter settings must be made on the PCB that controls the circuit
concerned.
1 Number of days
2 Heating set point temperature (°C)
3 Screed drying start temperature
4 Screed drying stop temperature
5 Start of the screed drying function
6 Number of days on which the screed drying function is activated
7 End of the screed drying function, back to normal running
Important
Every day at midnight, the screed drying start temperature set
point is recalculated and the remaining number of days on which
the screed drying function is running decreases.
1. Go to the Installer menu.
2. Access the Installer menu by entering the code 0012 by pressing the
and keys.
3. Confirm access by pressing the
key.
4. Select the desired circuit or PCB by pressing the or key.
Circuit
PCB
A
EHC–04
B
SCB-04
5. Configure the following parameters
Tab.63 Screed drying management parameter
Parameter
Description
CP470
Number of days of screed drying
CP480
Setting of the start temperature of the screed drying programm of the zone
CP490
Setting of the stop temperature of the screed drying programm of the zone
Fig.116 Screed drying curve
5
3
6
4
2
MW
-C
0
0
2
7
6
8
-3
00:00
00:00
00:00
7
1
Fig.117 Example
MW
-C
0
0
2
7
6
9
-3
5
3
10
9
8
7
6
5
4
3
2
1
23
20
26
29
32
35
38
41
44
47
6
1
4
2
00:00
00:00
00:00
7
10 Settings
7685645 - v04 - 07032018
AWHP-2 iMPI
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