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15-1
CHAPTER 15
MECHANICAL SPECIFICATIONS
The Pentium Pro processor is packaged in a modified staggered 387 pin ceramic pin grid array
(SPGA) with a gold plated Copper-Tungsten (CuW) heat spreader on top. Mechanical specifi-
cations and the pin assignments follow.
15.1.
DIMENSIONS
The mechanical specifications are provided in Table 15-1. Figure 15-1 shows the bottom and
side views with package dimensions for the Pentium Pro processor and Figure 15-2 shows the
top view with dimensions. Figure 15-3 is the top view of the Pentium Pro processor with VCCP,
VCCS, VCC5and VSS locations shown. Be sure to read Chapter 17, OverDrive® Processor
Socket Specification for the mechanical constraints for the OverDrive processor. Also, in-
vestigate the tools that will be used for debug before laying out the system. Intel’s tools are
described in Chapter 16, Tools.
Summary of Contents for Pentium Pro Family
Page 17: ...1 Component Introduction ...
Page 26: ...2 Pentium Pro Processor Architecture Overview ...
Page 27: ......
Page 36: ...3 Bus Overview ...
Page 62: ...4 Bus Protocol ...
Page 105: ...5 Bus Transactions and Operations ...
Page 126: ...6 Range Registers ...
Page 131: ...7 Cache Protocol ...
Page 135: ...8 Data Integrity ...
Page 148: ...9 Configuration ...
Page 161: ...10 Pentium Pro Processor Test Access Port TAP ...
Page 172: ...11 Electrical Specifications ...
Page 201: ...12 GTL Interface Specification ...
Page 229: ...13 3 3V Tolerant Signal Quality Specifications ...
Page 233: ...14 Thermal Specifications ...
Page 239: ...15 Mechanical Specifications ...
Page 241: ...15 2 MECHANICAL SPECIFICATIONS s Figure 15 1 Package Dimensions Bottom View ...
Page 252: ...16 Tools ...
Page 260: ...16 8 TOOLS Figure 16 4 Generic MP System Layout for Debug Port Connection ...
Page 264: ...17 OverDrive Processor Socket Specification ...
Page 290: ...A Signals Reference ...
Page 320: ...Index ...
Page 328: ......