IDEC MICRO/I HG4G-CJT22 F-B Series, User Manual, Page: 3 / 1665

WindO/I-NV4 User’s Manual
Preface-2
• Use the HG1P optional cable for proper wiring.
• The D-sub connector on the end of the HG1P optional cable is not water- or dust-proof. If protection against
water and dust is required, the user must replace the D-sub connector with a water-proof connector.
• Prevent the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P from falling while moving or transporting,
otherwise damage or malfunction of the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P will result.
• Use the product within the environmental limits given in the catalog and manual. Use of the product in high-
temperature or high-humidity environments, or in locations where it is exposed to condensation, corrosive gas
or large shock loads can create the risk of electrocution and fire.
• The HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P is designed for use in pollution degree 2. Use the
HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P in environments of pollution degree 2. (based on the
IEC60664-1 rating)
• Install the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P according to the instructions. Improper
installation will result in falling, failure, electrical shock, fire hazard, or malfunction of the HG5G/4G/3G/2G-V,
HG4G/3G, HG2G-5F/-5T, HG1G/1P.
• Prevent metal fragments or wire chips from dropping inside the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T,
HG1G/1P housing. Ingress of such fragments and chips may cause fire hazard, damage, and malfunction.
• Use a power supply of the rated value. Using a wrong power supply may cause fire hazard.
• The HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G uses “PS2 of EN61131” as DC power supply. (based on
the IEC/EN61131 rating)
• Use wire of a proper size to meet the voltage and current requirements, and tighten the terminal screws of the
HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G to the specified tightening torque.
• When exporting the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P to Europe, use an EN60127
(IEC60127) approved fuse on the power line outside the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P.
• When exporting the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P to Europe, use an EU-approved circuit
protector.
• Make sure of safety before starting and stopping the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P. Incorrect
operation of the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P may cause mechanical damage or accidents.
• Use the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P in a local area network if you download, upload
or monitor the project data via the Ethernet port.
• The touch panel of the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P is made of glass, and will break if
exposed to excessive shock. Take due care when handling it.
• Do not push hard or scratch the touch panel and protection sheet with a hard object such as a tool, because
they are damaged easily.
• At temperatures over the rated operating temperature, the clock accuracy is affected. Adjust the clock before
use.
• Do not install the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P in areas subjected to strong ultraviolet
rays, since ultraviolet rays may impair the quality of the LCD.
• Do not attempt to disassemble, repair or modify the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P. This
can create the risk of fire or electrocution.
• When disposing of the HG5G/4G/3G/2G-V, HG4G/3G, HG2G-5F/-5T, HG1G/1P, do so as an industrial waste.
• Be sure to confirm that the SD Memory Card Access lamp is not lit prior to turning the power off to the HG5G/
4G/3G/2G-V, HG4G/3G, HG2G-5F or pulling out the SD memory card. Refer to this manual for details.
• Do not switch off the power or pull out the SD Memory Card or the USB flash drive while it is being accessed, as
this may result in destruction of the stored data. If the data on the SD Memory Card or the USB flash drive is
corrupted, format the SD Memory Card or the USB flash drive.