System Options: Patterning
7-15
C O N F I D E N T I A L
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User Manual
Revision A
Feb 2018
Patterning
With this option, the Patterning menu, the Patterning page and some toolbar icons are available within the UI to
enable control over the entire process.
Patterning is the process of moving a beam over a defined
pattern along the specimen surface (while leaving other areas
untouched) with the purpose of
deposition
, adding well-defined
amounts of new material. The pattern is shown in color
appropriate to the gas selected.
The
Patterning
menu and the
Patterning Control
module control
the entire process.
C a u t i o n !
When deposing a large volume of material at higher currents, we
recommend removing any detector not in use. There is a risk of
decreasing a detector’s efficiency by material deposition.
The system provides additional monitoring possibilities:
•
Simultaneous Patterning and Imaging (SPI)
The SPI provides an electron imaging (in a display different from patterning) during patterning. It is strongly
influenced by secondary electrons (SE imaging), so the image quality is not perfect. Higher electron currents
(higher spot numbers) and averaging help improve imaging. In case the BSE detector is used, this interference is
less important (BSE imaging). The system remembers the brightness and contrast settings separately for SPI or
normal imaging.
•
Integrated Real Time Monitor (RTM)
The RTM provides an immediate image (in the same display with the patterning) of the patterning process. The
patterned area is observed, and in case of relatively slow scanning, the scan trajectory can be inspected.
RTM is typically used as an end-pointing device by observing brightness differences in the detector signal. These
result from contrast differences when milling through layers of different composition on a stack of multiple
materials.
RTM can be used with any of the pattern types that are available in the UI. When starting patterning with the
RTM activated, the pattern in the UI will be updated with real time image information. The patterned area
information is updated based on the detector signal, which is shown in synchronization with the beam trajectory.
It is possible to grab a snapshot with the electron beam during patterning while using RTM.
Note
The acquired data are matched to the calculated positions of the corresponding milling points. The pixels shown on the
screen might not therefore directly match what is happening on the sample surface, and some imaging artefacts (due to
milling points and screen pixels mismatch) can occur. To prevent this, try to change the field of view.
