Lenovo x3250 m6, Installation And Service Manual

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Step 3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat sink.
Note: Make sure that all of the thermal grease is removed.
Step 4. Use a clean area of the cleaning pad to wipe the thermal grease from the microprocessor. Then,
dispose of the cleaning pad after all of the thermal grease is removed.
Step 5. Use the thermal-grease syringe to place nine uniformly spaced dots 1 of 0.02 mL each on the
top of the microprocessor or on the bottom of the heat sink. The outermost dots must be within
approximately 5 mm of the edge of the microprocessor. This is to ensure uniform distribution of
the grease.
Figure 88. Thermal grease on the microprocessor
Figure 89. Thermal-grease syringe
Note: One tick mark on the syringe is 0.01 mL. If the grease is properly applied, approximately half
(0.22 mL) of the grease will remain in the syringe.
Step 6. Install the heat sink onto the microprocessor. See “Installing the microprocessor and heat sink
(Trained technician only)” on page 148.
Removing the power distribution board cover
To remove the power distribution board cover, do the following:
Step 1. Turn off the server. Then, disconnect all external cables and remove all peripheral devices.
Step 2. Remove the server cover. See “Removing the server cover” on page 88.
Step 3. Remove any connected SAS/SATA signal cable and all other cables that pass through the power
distribution board cover. See “Internal cable routing” on page 158.
Chapter 7
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Removing and installing server components
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