RL78/G1P
CHAPTER 1 OUTLINE
R01UH0895EJ0100 Rev.1.00
3
Nov 29, 2019
1.2 List of Part Numbers
Figure 1-1. Part Number, Memory Size, and Package
Part No.
R 5 F 1 1 Z x A x x x # x 0
Packaging specification
#00, #20: Tray (HWQFN)
#40: Embossed Tape (HWQFN)
#10, #30: Tray (LQFP)
#50: Embossed Tape (LQFP)
Package type:
NA: HWQFN, 4 × 4 mm, 0.50 mm pitch
FP: LQFP, 7 × 7 mm, 0.80 mm pitch
Fields of application:
A: Consumer applications, T
A
= -40 to +85°C
D: Industrial applications, T
A
= -40 to +85°C
ROM capacity:
A: 16 KB
RL78/G1P group
Memory type:
F: Flash memory
Renesas semiconductor product
Renesas MCU
Pin count:
7: 24-pin
B: 32-pin
Pin Count
Package
Data Flash
Fields of
Application
Packaging
Specification
Part Number
24 pins
24-pin plastic HWQFN
(4 × 4 mm, 0.5 mm pitch)
2 KB
A
Tray
R5F11Z7AANA#00,
R5F11Z7AANA#20
Embossed Tape
R5F11Z7AANA#40
D Tray R5F11Z7ADNA#00,
R5F11Z7ADNA#20
Embossed Tape
R5F11Z7ADNA#40
32 pins
32-pin plastic LQFP
(7 × 7 mm, 0.8 mm pitch)
A Tray R5F11ZBAAFP#10,
R5F11ZBAAFP#30
Embossed Tape
R5F11ZBAAFP#50
D Tray R5F11ZBADFP#10,
R5F11ZBADFP#30
Embossed Tape
R5F11ZBADFP#50