Table 14. BA000010 to BA400002 Partition firmware SRCs (continued)
v
Follow the suggested actions in the order in which they are listed in the Action column until the problem is
solved. If an action solves the problem, then you can stop performing the remaining actions.
v
See Chapter 3, “Parts listing, Type 7998,” on page 235 to determine which components are CRUs and which
components are FRUs.
Error code
Description
Action
BA180100
The FDDI adapter Fcode driver is not
supported on this server.
IBM may produce a compatible driver in the
future, but does not guarantee one.
BA180101
Stack underflow from fibre-channel
adapter
1.
Go to “Checkout procedure” on page 186.
2.
Replace the system-board and chassis
assembly, as described in “Replacing the
Tier 2 system-board and chassis assembly”
on page 274.
BA190001
Firmware function to get/set
time-of-day reported an error
1.
Go to “Checkout procedure” on page 186.
2.
Replace the system-board and chassis
assembly, as described in “Replacing the
Tier 2 system-board and chassis assembly”
on page 274.
BA201001
The serial interface dropped data
packets
1.
Go to “Checkout procedure” on page 186.
2.
Replace the system-board and chassis
assembly, as described in “Replacing the
Tier 2 system-board and chassis assembly”
on page 274.
BA201002
The serial interface failed to open
1.
Go to “Checkout procedure” on page 186.
2.
Replace the system-board and chassis
assembly, as described in “Replacing the
Tier 2 system-board and chassis assembly”
on page 274.
BA201003
The firmware failed to handshake
properly with the serial interface
1.
Reboot the blade server.
2.
If the problem persists:
a.
Go to “Checkout procedure” on page
186.
b.
Replace the system-board and chassis
assembly, as described in “Replacing the
Tier 2 system-board and chassis
assembly” on page 274.
BA210000
Partition firmware reports a default
catch
1.
Reboot the blade server.
2.
If the problem persists:
a.
Go to “Checkout procedure” on page
186.
b.
Replace the system-board and chassis
assembly, as described in “Replacing the
Tier 2 system-board and chassis
assembly” on page 274.
78
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