CyberOptics SE505, Hardware Manual

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Chapter 2 : System Overview
26 SE505 Hardware Manual
System Specifications
Table 6. System Specifications
Dimensions
Unit Height 139 cm (55 in.) excluding signal-light pole and leveling
feet
Unit Width 100 cm (39 in.)
Unit Depth 127 cm (50 in.)
Distance from fixed front rail to back of
machine 92 cm (36 in.)
Conveyor Height 86 to 104 cm (34 to 41 in.)
Weight 650 kg (1433 lbs.)
Panel Specifications
Panel Size Capacity
●
Maximum
●
Minimum
510

510 mm (20

20 in.)
50

50 mm (2

2 in.)
Board Thickness 0.3 to 5.0 mm (0.01 to 0.2 in.)
Board Edge Clearance (mechanical)
●
Top
●
Bottom
2.5 mm (0.10 in.)
3 mm (0.12 in.)
Component Clearance
● Topside (above belt)
● Bottom side
20.1 mm (0.78 in.)
25.4 mm (1.0 in.)
Maximum Board Weight 3 kg (6.6 lbs.)
Maximum Board Warp < 2% of PCB diagonals or a maximum of 6.35 mm
(0.25 in.) total
Operational Specifications
Conveyor Speed Range 150–450 mm/sec (5.9–17.7 in./sec)
Conveyor Adjustment Automatic
Maximum Inspection Area 508

503 mm (20

19.5 in.)
Maximum Pad Size in FOV 15

15 mm (0.6

0.6 in.)
Field-Of-View (FOV) 32

32 mm (1.26

1.26 in.)
X and Y Pixel Size
●
High-speed
●
High-resolution
30 µm (1.2 mils)
15 µm (0.6 mils)
Height Resolution 0.2 µm (0.008 mils)
Paste Height Range (With Optional
Sensor) 50–500 µm (2–20 mils)
Temperature Range
Warm Up Time (for repeatability and
accuracy specifications) Recommended 25°C, ± 2°C
30 minutes
Hardware Specifications
Processor
a
Two of Intel

5000X chipset, Quad-Core 2.0 GHz CPU