Cognex In-Sight 1721, User Manual

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3 Configuring a Wafer ID Application
In this section…
3.1 SEMI
®
Wafer Marking Specifications.......................................................................19
3.2 Basic Concepts........................................................................................................20
3.3 GUI Overview...........................................................................................................20
3.4 Getting an Image .....................................................................................................21
3.5 Defining Config Settings ..........................................................................................23
3.6 Setting Options ........................................................................................................37
3.1 SEMI
®
Wafer Marking Specifications
The In-Sight wafer reader identifies wafers marked according to the following
specifications:
SEMI T7-0997 – Specification For Back Surface Marking of Double-Side
Polished Wafers With A Two-Dimensional Matrix Code . Defines the
characteristics and positioning of the rectangular 2D Data Matrix code symbol
marked on the back surface of 300mm wafers.
SEMI M12-0998 – Specification For Serial Alphanumeric Marking of the Front
Surface Of Wafers . Defines the characteristics and positioning of the 12-character
alphanumeric string marked on the front surface of 100/125/150mm (flatted) and
150/200mm (notched) wafers.
SEMI M1.15-1000 – Standard For 300mm Polished Monocrystalline Silicon
Wafers (Notched). Combines elements of the SEMI T7 and SEMI M12 specifications
for defining the characteristics and positioning of the rectangular 2D Data Matrix code
symbol and the (optional) 12-character alphanumeric string marked on the back
surface of 300mm wafers.
SEMI M13-0998 – Specification For Alphanumeric Marking Of Silicon Wafers .
Defines the characteristics and positioning of the 18-character alphanumeric string
marked on 100/125/150mm (flatted) and 150/200mm (notched) wafers.
SEMI T1-95 – Specification For Back Surface Bar Code Marking Of Silicon
Wafers . Defines the characteristics and positioning of the barcode marked on the
back surface of 125mm or larger wafers.
For copies of the complete specifications, visit the Semiconductor Equipment and
Materials International (SEMI) organization at:
www.semi.org .
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