Technical data • Fully assembled device
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Automation PC 810 with GM45 CPU board user's manual V1.28
2 Fully assembled device
2.1 Temperature specifications
CPU boards can be combined with various other components such as drives, main memory, additional insert cards,
etc. depending on the system unit and fan kit. The many different configurations possible result in varying maximum
ambient temperatures, which can be seen in the following tables in this section.
Information:
The maximum specified ambient temperatures for operation with and without a fan kit have been de-
termined under worst-case conditions. Experience has shown that higher ambient temperatures can
be reached in typical applications, e.g. those in Microsoft Windows. Testing and evaluation must be
performed on-site by the user (temperatures can be read in BIOS or with the B&R Control Center).
Information regarding worst-case conditions
•
Thermal Analysis Tool (TAT V3.8.1) from Intel for simulating a 100% processor load
•
BurnInTest tool (BurnInTest V4.0 Pro from Passmark Software) for simulating a 100% load on the interface
via loop back adapters (serial interfaces, add-on and slide-in drives, USB ports, audio outputs)
•
Maximum system expansion and power consumption
What must be considered when determining the maximum ambient temperature?
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Operating the Ethernet interfaces (ETH1/ETH2) in 10/100 Mbit or 1 Gbit mode
•
Revision of heat sink being used
