iWave iW-G36S-2CG1-4E002G-E008G-BEA, Hardware User'S Manual, Page: 5 / 88

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Page 5 of 88
Zynq Ult MPSoC SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.9.4 RTC Header .................................................................................................................................................. 41
2.9.5 Power On/OFF Switch ................................................................................................................................. 42
2.9.6 Reset Switch ................................................................................................................................................ 42
2.10 Board to Board Connector1 ............................................................................................................................ 43
2.10.1 PS Interfaces ................................................................................................................................................ 45
2.10.1.1 SPI Interface .................................................................................................................................... 45
2.10.1.2 CAN Interface .................................................................................................................................. 45
2.10.1.3 I2C Interface .................................................................................................................................... 46
2.10.2 PL Interfaces ................................................................................................................................................ 46
2.10.2.1 PL IOs – HP BANK64 ........................................................................................................................ 46
2.10.2.2 PL IOs – HD BANK45 ........................................................................................................................ 51
2.10.3 Power .......................................................................................................................................................... 52
2.11 Board to Board Connector2 ............................................................................................................................ 53
2.11.1 PL Interfaces ................................................................................................................................................ 55
2.11.1.1 PL IOs – HP BANK64 ........................................................................................................................ 55
2.11.1.2 PL IOs – HD BANK45 ......................................................................................................................... 58
2.11.1.3 PL IOs – HD BANK46 ......................................................................................................................... 60
2.11.2 Power .......................................................................................................................................................... 65
2.12 Board to Board Connector3 ............................................................................................................................ 66
2.12.1 PL Interfaces ................................................................................................................................................ 68
2.12.1.1 PL IOs – HD BANK43 ......................................................................................................................... 68
2.12.1.2 PL IOs – HD BANK44 ......................................................................................................................... 73
2.12.2 Power .......................................................................................................................................................... 77
2.13 Zynq Ult MPSoC PS Pin Multiplexing on Board to Board Connectors ............................................... 78
3. TECHNICAL SPECIFICATION.......................................................................................................................... 80
3.1 Power Input Requirement .............................................................................................................................. 80
3.2 Power Output Specification ............................................................................................................................ 81
3.2.1 Power Consumption .................................................................................................................................... 81
3.3 Environmental Characteristics ........................................................................................................................ 82
3.3.1 Temperature Specification .......................................................................................................................... 82
3.3.2 RoHS2 Compliance ...................................................................................................................................... 82
3.3.3 Electrostatic Discharge ................................................................................................................................ 82
3.3.4 Heat Sink ..................................................................................................................................................... 82
3.4 MechanicalCharacteristics .............................................................................................................................. 83
3.4.1 Zynq Ult MPSoC SBC Mechanical Dimensions ............................................................................... 83
4. ORDERING INFORMATION .......................................................................................................................... 85