In
the
United
States,
IBM
has
a
process
for
the
collection
of
this
battery.
For
information,
call
1-800-426-4333.
Have
the
IBM
part
number
for
the
battery
unit
available
when
you
call.
(RSFTC225)
4.
Install
the
battery
pack
by
reversing
the
removal
procedure.
After
exchanging
an
item,
go
to
5.
After
you
install
the
new
battery,
use
HSM
to
perform
a
battery
test
to
ensure
correct
operation.
This
ends
the
procedure.
Models
830/SB2
with
FC
9074
-
Cards
(concurrent)
For
use
by
authorized
service
providers.
Use
this
procedure
to
remove
or
replace
cards
concurrently
in
the
Models
830/SB2
with
FC
9074.
Concurrent/dedicated
guidelines
for
Model
830/SB2
with
FC
9074
In
some
cases
you
do
not
need
to
power
down
the
system
to
change
PCI
cards.
Use
the
following
guidelines
to
determine
if
you
should
use
dedicated
or
concurrent
remove
and
replace
procedures.
If
you
use
concurrent
maintenance
on
a
partitioned
system,
follow
the
procedures
from
the
partition
that
owns
the
resource.
If
the
resource
is
not
owned,
follow
the
procedure
from
the
primary
partition.
For
cards
in
the
Models
830/SB2
CEC/system
unit:
No
card
positions
in
the
(top)
CEC/system
unit
permit
concurrent
maintenance.
You
must
power
down
the
system
to
exchange
a
card.
See
For
Models
830/SB2
base
I/O
tower
(FC
9074)
IXS
cards:
The
IXS
cards
require
dedicated
maintenance.
See
For
Models
830/SB2
base
I/O
tower
cards
(FC
9074)
-
except
IXS
cards:
v
Card
positions
C01
through
C07
and
C09
through
C15
permit
concurrent
maintenance
using
HSM.
You
can
power
down
the
individual
card
slot,
but
you
can
not
power
down
the
tower.
v
If
the
resource
is
the
load
source
IOA
or
the
load
source
IOP,
or
any
other
storage
IOA/IOP
with
critical
DASD
attached
for
the
system,
primary,
or
secondary
partition,
follow
the
on-screen
instructions
when
you
use
HSM
to
power
down
the
IOP
or
IOA.
Instructions
to
use
functions
68
and
69
on
the
control
panel
will
be
included.
v
If
the
resource
is
the
console
IOA
or
the
console
IOP
for
the
system
or
primary
partition,
you
cannot
power
down
the
domain.
v
If
the
resource
is
the
console
IOA
or
the
console
IOP
for
a
secondary
partition,
then
power
down
the
secondary
partition
and
follow
the
procedure
from
the
primary
partition.
v
All
other
card
positions
require
dedicated
maintenance.
See
CAUTION:
The
circuit
card
contains
lead
solder.
To
avoid
the
release
of
lead
(Pb)
into
the
environment,
do
not
burn.
Discard
the
circuit
card
as
instructed
by
local
regulations.
(RSFTC234)
Attention:
If
removing
the
cover
while
powered
on,
errors
may
occur
due
to
electromagnetic
interference.
Attention:
All
cards
are
sensitive
to
electrostatic
discharge
(see
To
remove
or
replace
cards
(concurrently):
1.
From
the
Hardware
Service
Manager
display,
select
Packaging
hardware
resources
.
52
Hardware
(Remove
and
Replace;
Part
Locations
and
Listings)
Summary of Contents for 270
Page 2: ......
Page 12: ...x Hardware Remove and Replace Part Locations and Listings...
Page 279: ...Figure 3 CCIN 2881 with pluggable DIMM Analyze hardware problems 267...
Page 281: ...Figure 6 Models 830 SB2 with FC 9074 HSL and SPCN locations Analyze hardware problems 269...
Page 283: ...Figure 1b Model 840 SB3 processor tower dual line cord Analyze hardware problems 271...
Page 294: ...01 gif port and LED locations 282 Hardware Remove and Replace Part Locations and Listings...
Page 295: ...s src rzaq4519 gif locations Analyze hardware problems 283...
Page 483: ...Table 1 Cover assembly FC 5095 Expansion I O Tower Analyze hardware problems 471...
Page 614: ...602 Hardware Remove and Replace Part Locations and Listings...
Page 618: ...606 Hardware Remove and Replace Part Locations and Listings...
Page 621: ......
Page 622: ...Printed in USA SY44 5917 02...