3.
At
this
point,
the
cover
can
be
removed
from
the
module
to
expose
the
interposer.
4.
To
remove
the
cover
from
the
bottom
half
of
the
interposer,
perform
the
following:
a.
Place
the
module
on
the
ESD
mat.
b.
Place
your
thumb
over
one
of
the
release
latches
and
your
forefinger
over
the
opposite
latch.
Note:
To
ensure
proper
grip,
your
thumb
and
finger
should
be
directly
over
the
latches
and
the
cover,
not
just
at
the
ends
of
the
latches.
Figure
3.
Place
thumb
and
forefinger
on
the
release
latches
Analyze
hardware
problems
117
Summary of Contents for 270
Page 2: ......
Page 12: ...x Hardware Remove and Replace Part Locations and Listings...
Page 279: ...Figure 3 CCIN 2881 with pluggable DIMM Analyze hardware problems 267...
Page 281: ...Figure 6 Models 830 SB2 with FC 9074 HSL and SPCN locations Analyze hardware problems 269...
Page 283: ...Figure 1b Model 840 SB3 processor tower dual line cord Analyze hardware problems 271...
Page 294: ...01 gif port and LED locations 282 Hardware Remove and Replace Part Locations and Listings...
Page 295: ...s src rzaq4519 gif locations Analyze hardware problems 283...
Page 483: ...Table 1 Cover assembly FC 5095 Expansion I O Tower Analyze hardware problems 471...
Page 614: ...602 Hardware Remove and Replace Part Locations and Listings...
Page 618: ...606 Hardware Remove and Replace Part Locations and Listings...
Page 621: ......
Page 622: ...Printed in USA SY44 5917 02...
