13.4 Grounding Vias
The pad on the bottom of the device functions as both the sole electrical ground and primary heat transfer path. Hence it is important to
minimize the inductance and maximize the heat transfer from this pad to the internal ground plane of the PCB. Use no fewer than 25
vias from the center pad to a ground plane under the device. In general, more vias will perform better. Having the ground plane near the
top layer will also help to minimize the via inductance from the device to ground and maximize the heat transfer away from the device.
Si5397/96 Reference Manual
Power Management
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