9-1
9
Part Handling
System
The IX-6168-PS workstation processes a part by holding it securely and then moving it
in precisely defined ways under the laser beam. The system computer controls all
motion during processing.
The IX-6168-PS process wafers or other flat parts, which are held in place by a vacuum
chuck. The chuck mounts on top of one or more motion stages. It can also process
cylindrical parts, which are held and rotated by a part spindle. The spindle also
mounts on top of a motion stage.
This chapter describes the components typically used in the IX-6168-PS part handling
systems.
Содержание IX-6168-PS
Страница 1: ...IX 6168 PS Laser Micromachining System Hardware Reference Guide...
Страница 26: ...Safety 1 20...
Страница 32: ...System Overview 2 6...
Страница 40: ...Starting and Shutting Down 3 8...
Страница 66: ...Pneumatic Components 6 10...
Страница 88: ...Electronic and Computer Components 7 22...
Страница 108: ...Ventilation and Debris Control 10 6...