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W83627DHG
Publication Release Date: Aug, 22, 2007
-254- Version
1.4
22. TOP MARKING SPECIFICATION
1st line: Winbond logo
2nd line: part number: W83627DHG (Pb-free package)
3rd line: tracking code 606G9C28201234UB
606
: packages made in '06, week 06
G
: assembly house ID; G means GR, A means ASE, etc.
9
: code version; 9 means code 009
C
: IC revision; A means version A; B means version B, and C means version C
28201234
: wafer production series lot number
UB
: Winbond internal use.
inbond
W83627DHG
606G9C28201234UB
Summary of Contents for W83627DHG
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