I-6
I
Multiple position measurement .................................................................................................... 12-6
Object counting by binary conversion ............................................................................................ 9-5
Object identification (labeling) by binary conversion .................................................................... 10-5
Point measurements .................................................................................................................... 11-5
Positional deviation measurement ................................................................................................. 4-5
Operation screen display .................................................................................................................. 2-10
Operation set menu ............................................................................................................................ 2-1
Operations menu lock ....................................................................................................................... 1-14
Operation to return to MAIN OPS MENU ......................................................................................... 1-12
Other settings and operations .......................................................................................................... 15-1
OR (evaluation) ................................................................................................................................ 11-3
Output code ......................................................................................................................... 18-16, 19-17
Output block assignment ................................................................................................................ 17-21
Output conditions .............................................................................................................................. 16-3
Area measurement by binary conversion ............................................................................. 8-7, 16-9
BGA/CSP inspection ............................................................................................................. 7-6, 16-9
Degree of match inspection .................................................................................................. 5-4, 16-9
Distance and angle measurement .................................................................................... 14-5, 16-10
Lead inspection ..................................................................................................................... 6-4, 16-9
Multiple degree of match inspection ................................................................................. 13-4, 16-10
Multiple position measurement ......................................................................................... 12-5, 16-10
Object counting by binary conversion ................................................................................... 9-5, 16-9
Object identification (labeling) by binary conversion ......................................................... 10-5, 16-10
Point measurements ......................................................................................................... 11-4, 16-10
Positional deviation measurement ........................................................................................ 4-5, 16-9
Output monitor .................................................................................................................................... 2-1
[P]
PARITY CHACK ............................................................................................................................. 17-19
PC function ....................................................................................................................................... 16-1
PC monitor screen .......................................................................................................................... 16-19
PC scan cycle ................................................................................................................................... 16-2
Parallel input X6 ............................................................................................................................... 17-1
Parallel input X7 ........................................................................................................................ 2-4, 17-2
Pattern display .................................................................................................................................... 2-7
Pattern settings ................................................................................................................................... 3-4
Point condition .................................................................................................................................. 11-2
Point measurement .......................................................................................................................... 11-1
Position correction ............................................................................................................................ 3-26
Positional deviation measurement ...................................................................................................... 4-1
Pre-processing ................................................................................................................................. 3-15
[R]
RAM initialization .............................................................................................................................. 2-15
RE-EXAM-NG (re-examine NG) ......................................................................................................... 1-5
Reading result ................................................................................................................ 18-1, 18-9 to 11