LSIS XGB Series, User Manual, Page: 418 / 618

XGB Analog edition manual
11.14 Configuration and Function of Internal Memory
Here describes configuration and function of internal memory.
11.14.1 Data I/O area
Data I/O area of RTD input option board is as shown below.
Variable Type
Device
Description R/W Signal direction
XBC IEC
_0y_ERR Bit U0y.00.0 %UX0.y.0 Module error R
Option → CPU
_0y_RDY Bit U0y.00.F %UX0.y.15 Module Ready R
_0y_CH0_ACT Bit U0y.01.0 %UX0.y.16 CH0 running R
Option → CPU
_0y_CH0_BOUT Bit U0y.01.4 %UX0.y.20 CH0 disconnection R
Option → CPU
_0y_CH0_TEMP Word U0y.04 %UW0.y.4 CH0 temp. value R
Option → CPU
- In the device allocation, the small letter ‘y’ is the No. of the slot where the module is installed.
- For example, to read the ‘CH0 Temperature Value’ of the RTD module installed in the slot 9, write in
U09.05. (%UW0.9.4 for IEC types)
Device Type
U 0 9 . 0 4
Slot No .
Word
[ XBC t ype]
Word classifier
Device Type
Slot No .
Base No
Word
[ IEC type ]
% U W 0 . 9 . 4
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