ML610471/472/473/Q471/Q472/Q473 User's Manual
Appendix B Package Dimensions
Appendix B-2
48 pin TQFP Package
P-TQFP48-0707-0.50-K
Package material
Epoxy resin
Lead frame material
42 alloy
Lead finish
Sn-2Bi (Bi 2%typ.)
Solder thickness
More than 5
μ
m
Package weight (g)
0.13typ.
Rev. No./Last Revised
3 / Nov. 9,2011
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name,
pin number, package code and desired mounting conditions (reflow method, temperature and times).
Summary of Contents for ML610472
Page 12: ...Chapter 1 Overview...
Page 38: ...Chapter 2 CPU and Memory Space...
Page 44: ...Chapter 3 Reset Function...
Page 48: ...Chapter 4 MCU Control Function...
Page 62: ...Chapter 5 Interrupts...
Page 82: ...Chapter 6 Clock Generation Circuit...
Page 94: ...Chapter 7 Time Base Counter...
Page 105: ...Chapter 8 Capture...
Page 114: ...Chapter 9 Timer...
Page 133: ...Chapter 10 Watchdog Timer...
Page 141: ...Chapter 11 UART...
Page 164: ...Chapter 12 Port 0...
Page 173: ...Chapter 13 Port 2...
Page 180: ...Chapter 14 Port 3...
Page 188: ...Chapter 15 Port 4...
Page 199: ...Chapter 16 Port 6...
Page 205: ...Chapter 17 RC Oscillation Type A D Converter...
Page 225: ...Chapter 18 LCD Drivers...
Page 243: ...Chapter 19 Power Supply Circuit...
Page 245: ...Chapter 20 uEASE Flash Writer System...
Page 249: ...Chapter 21 Software Development...
Page 258: ...Appendixes...
Page 280: ...Revision History...