LAPIS Semiconductor ML610472, User Manual

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ML610471/ML610472/ML610473 User’s Manual
Contents
Contents –6
Chapter 19
19. Power Supply Circuit.................................................................................................................................. 19-1
19.1 Overview ................................................................................................................................................. 19-1
19.1.1 Features .............................................................................................................................................. 19-1
19.1.2 Configuration ..................................................................................................................................... 19-1
19.1.3 List of Pins ......................................................................................................................................... 19-1
Chapter 20
20. uEASE Flash Writer System......................................................................................................................... 20-1
20.1 Overview ................................................................................................................................................. 20-1
20.2 Method of Connecting to the uEASE ...................................................................................................... 20-1
20.3 Method of writing to the Flash memory .................................................................................................. 20-2
20.4 Flash Memory Rewrite Function ............................................................................................................. 20-3
Chapter 21
21. Software Development ................................................................................................................................. 21-1
21.1 Overview ................................................................................................................................................. 21-1
21.2 Development Version Setting Sequence ................................................................................................. 21-1
21.3 Development Version Resetting Sequence.............................................................................................. 21-2
21.4 Notice for the Software Program Development ...................................................................................... 21-2
21.4.1 Notice for the Development Version Mode Setting Data .................................................................. 21-2
21.4.2 Notice for the Development Version Memory Size ........................................................................... 21-4
21.5 The Detail Specification of Development Version.................................................................................. 21-5
Appendix
Appendix.A Registers......................................................................................................................................... A-1
Appendix.B Package Dimensions....................................................................................................................... B-1
Appendix.C Electrical Characteristics ................................................................................................................ C-1
Appendix.D Application Circuit Example.......................................................................................................... D-1
Appendix.E Ckeck List........................................................................................................................................E-1