Heatsink Clip Load Metrology
72
Thermal and Mechanical Design Guidelines
B.2.2
Typical Test Equipment
For the heatsink clip load measurement, use equivalent test equipment to the one
listed Table 11.
Table 11. Typical Test Equipment
Item Description Part Number
(Model)
L
o
a
d
c
e
l
l
N
o
t
e
s
:
1
,
5
Honeywell*-Sensotec* Model
13 subminiature load cells,
compression only
Select a load range depending
on load level being tested.
www.sensotec.com
AL32
2BL
D
a
t
a
L
o
g
g
e
r
(
o
r
s
c
a
n
n
e
r
)
N
o
t
e
s
:
2
,
3
,
4
Vishay* Measurements Group
Model 6100 scanner with a
6010A strain card (one card
required per channel).
Model
6100
NOTES:
1.
Select load range depending on expected load level. It is usually better, whenever possible,
to operate in the high end of the load cell capability. Check with your load cell vendor for
further information.
2.
Since the load cells are calibrated in terms of mV/V, a data logger or scanner is required to
supply 5 volts DC excitation and read the mV response. An automated model will take the
sensitivity calibration of the load cells and convert the mV output into pounds.
3.
With the test equipment listed above, it is possible to automate data recording and control
with a 6101-PCI card (GPIB) added to the scanner, allowing it to be connected to a PC
running LabVIEW* or Vishay's StrainSmart* software.
4.
IMPORTANT: In addition to just a zeroing of the force reading at no applied load, it is
important to calibrate the load cells against known loads. Load cells tend to drift. Contact
your load cell vendor for calibration tools and procedure information.
5.
When measuring loads under thermal stress (bake for example), load cell thermal capability
must be checked, and the test setup must integrate any hardware used along with the load
cell. For example, the Model 13 load cells are temperature compensated up to 71°C, as
long as the compensation package (spliced into the load cell's wiring) is also placed in the
temperature chamber. The load cells can handle up to 121°C (operating), but their
uncertainty increases according to 0.02% rdg/°F.
B.3
Test Procedure Examples
The following sections give two examples of load measurement. However, this is not
meant to be used in mechanical shock and vibration testing.
Any mechanical device used along with the heatsink attach mechanism will need to be
included in the test setup (i.e., back plate, attach to chassis, etc.).
Prior to any test, make sure that the load cell has been calibrated against known
loads, following load cell vendor’s instructions.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
