LGA775 Socket Heatsink Loading
12
Thermal and Mechanical Design Guidelines
Term Description
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
P
MAX
The maximum power dissipated by a semiconductor component.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS
Integrated Heat Spreader: a thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
LGA775 Socket
The surface mount socket designed to accept the processors in the 775–Land LGA
package.
ACPI
Advanced Configuration and Power Interface.
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Thermal
Monitor
A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
TCC
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
DTS
Digital Thermal Sensor: Processor die sensor temperature defined as an offset from
the onset of PROCHOT#.
T
DIODE
Temperature reported from the on-die thermal diode.
FSC
Fan Speed Control: Thermal solution that includes a variable fan speed which is
driven by a PWM signal and uses the digital thermal sensor as a reference to change
the duty cycle of the PWM signal.
T
CONTROL_BASE
Constant from the processor datasheet that is added to the
T
CONTROL_OFFSET
that
results in the value for
T
CONTROL
T
CONTROL_OFFSET
Value read by the BIOS from a processor MSR and added to the
T
CONTROL_BASE
that
results in the value for
T
CONTROL
T
CONTROL
T
CONTROL
is the specification limit for use with the digital thermal sensor.
PWM
Pulse width modulation is a method of controlling a variable speed fan. The enabled
4 wire fans use the PWM duty cycle % from the fan speed controller to modulate the
fan speed.
Health Monitor
Component
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
BTX
Balanced Technology Extended
TMA
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution
§
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
