Intel Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines
39
5
Intel Thermal/Mechanical
Reference Design Information
The Intel Advanced Liquid Cooling Technology or ALCT is composed of three
components: a liquid to air radiator type heat exchanger; a 12 0mm fan; and an
integrated pump with cold plate. The heat exchanger is connected to the pump with
flexible hoses.
The heart of the design is the integrated pump cold plate combination. The cold plate
is nested within a centrifugal pump impeller. This unique design takes advantage of
the radial pull of the impeller to provide a uniform flow across the cold plate. The inlet
flow returning from the heat exchanger impinges on the center of the cold plate. The
centrifugal impeller then pulls the fluid across and through the cold plate fins. The fins
in turn act as an inducer for the impeller. The fluid is then accelerated through the
impeller and collected in a double involute and returned to the exchanger.
There are several unique features of the design in addition to the integration of pump
and cold plate. There are no dynamic seals in the pump. The impeller is an integral
part of the motor and is directly driven through a magnetic couple. There are no seals
between the upper and lower pump housings. The seal is a function of the molding
process. The copper cold plate is molded into the lower housing. The metal to plastic
seal is also a function of the molding process.
The unit is maintenance free. Through careful selection of materials and the unique
heat exchanger design that contains a reservoir the units are sealed for life. In
addition every unit is proof pressure tested, vacuum decay tested, helium leak
checked and the motor RPM is verified.
5.1
Validation Results for the ATX Reference Design
The reference thermal solution is a liquid cooled design, with an integrated pump and
cold-plate (or chiller) and a remote heat exchanger with an attached fan. This solution
is called the Intel Advanced Liquid Cooling Technology Reference Design (Intel ALCT
Reference Design).
The reference solution pump and cold-plate module is compliant with the reference
ATX motherboard keep-out and height recommendations defined Section
5.5 through
the tubing that carries the working fluid from the pump/cold-plate protrudes through
this keep-out and the heat exchanger is located on the back panel of the chassis.
The solution comes as an integrated assembly. The major ALCT components are
provided Figure 16.
Note:
If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection (e.g.,
protection barriers, a cage, or an interlock) against contact with the energized fan by
the user during user servicing.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
