LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines
67
Figure 27. Example: Defining Heatsink Preload Meeting Board Deflection Limit
A.2.5
Additional Considerations
Intel recommends to design to {d_BOL – d_ref = 0.15 mm} at BOL when EOL
conditions are not known or difficult to assess
The following information is given for illustration only. It is based on the reference
keep-out, assuming there is no fixture that changes board stiffness:
d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm
As a result, the board should be able to deflect 0.37 mm minimum at BOL
Additional deflection as high as 0.09 mm may be necessary to account for additional
creep effects impacting the board/clip assembly. As a result, designs could see as
much as 0.50mm total downward board deflection under the socket.
In addition to board deflection, other elements need to be considered to define the
space needed for the downward board total displacement under load, like the potential
interference of through-hole mount component pin tails of the board with a
mechanical fixture on the back of the board.
NOTES:
1.
The heatsink preload must remain below the maximum load limit of the package
at all times (Refer to processor
datasheet
)
2.
Board deflection should not exceed motherboard manufacturer specifications.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
