LGA775 Socket Heatsink Loading
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Thermal and Mechanical Design Guidelines
5.2
Environmental Reliability Testing
5.2.1
Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests
of a given thermal solution in the assembled state. The thermal solution should meet
the specified thermal performance targets after these tests are conducted; however,
the test conditions outlined here may differ from your own system requirements.
5.2.1.1
Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 G RMS
Figure 11. Random Vibration PSD
0.001
0.01
0.1
1
10
100
1000
Frequency (Hz)
PSD
(
g
^
2
/H
z
)
3.13GRMS (10 minutes per axis)
5 Hz
500 Hz
(5, 0.01)
(20, 0.02)
(500, 0.02)
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
