BTX System Thermal Considerations
110
Thermal and Mechanical Design Guidelines
The thermal sensor location and elevation are reflected in the Flotherm thermal model
airflow illustration and pictures (see Figure 64and Figure 65).The Intel
®
Boxed Boards
in BTX form factor have implemented a System Monitor thermal sensor. The following
thermal sensor or its equivalent can be used for this function:
Part Number: C83274-002
BizLink USA Technology, Inc.
44911 Industrial Drive
Fremont, CA 94538 USA
(510)252-0786 phone
(510)252-1178 fax
Part Number: 68801-0170
Molex Incorporated
2222 Wellington Ct.
Lisle, IL 60532
1-800-78MOLEX phone
1-630-969-1352 fax
Figure 64. System Airflow Illustration with System Monitor Point Area Identified
OM16791
Power Supply
Unit
Thermal
Module
MCH
Memory
Graphics
Add-In Card
Monitor Point
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
