Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines
17
Figure 2. Processor Case Temperature Measurement Location
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.
5 m
m
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.
5 m
m
2.2.2
Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. Refer to the datasheet for the further information.
While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35 °C ambient temperature external to the
system.
For ATX platforms using the Intel
®
Core™2 Extreme processor QX6800 B3 stepping
and QX9770 C0 stepping, an active liquid-cooled design should be designed to
manage the heat exchanger inlet temperature of 35 ºC + 3 ºC = 38 ºC (see
Chapter
5).
For BTX platforms, the similar BTX liquid cooling design should be designed to manage
the heat exchanger inlet temperature of 35 ºC + 0.5 ºC = 35.5 ºC.
The slope of the thermal profile was established to be the same as the Intel liquid
cooling solution thermal solution performance. This performance is expressed as the
slope on the thermal profile and can be thought of as the thermal resistance of the
heatsink attached to the processor,
Ψ
CA
(Refer to Section
3.1). The intercept on the
thermal profile assumes a maximum ambient operating condition that is consistent
with the available chassis solutions.
The thermal profiles for the processor are defined such that a single thermal solution
(e.g., ALCT reference design) can be used for Intel
®
Core™2 Extreme processor
QX6800 B3 Stepping and QX9770 C0 Stepping processors. See Chapter
5 for a
discussion of the ALCT reference design. To determine compliance to the thermal
profile, a measurement of the actual processor power dissipation is required. The
measured power is plotted on the Thermal Profile to determine the maximum case
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
