LGA775 Socket Heatsink Loading
6
Thermal and Mechanical Design Guidelines
Figures
Figure 1. Package IHS Load Areas .....................................................................13
Figure 2. Processor Case Temperature Measurement Location ...............................17
Figure 3. Example Thermal Profile .....................................................................18
Figure 4. Processor Thermal Characterization Parameter Relationships....................24
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink ........27
Figure 6. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat
Exchanger.........................................................................................28
Figure 7. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......28
Figure 8. Concept for Clocks under Thermal Monitor Control..................................33
Figure 9. Thermal Monitor 2 Frequency and Voltage Ordering ................................34
Figure 10. T
CONTROL
for Digital Thermometer ........................................................37
Figure 11. Random Vibration PSD......................................................................44
Figure 12. Shock Acceleration Curve ..................................................................45
Figure 13. The Assembly Cumulative Mass Loss Data in Continuous Operation
Test at 50 ºC and 1450 RPM ..............................................................49
Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir...........................49
Figure 15. Reservoir Location............................................................................50
Figure 16. Intel
®
ALCT Reference Design Major Components .................................53
Figure 17. Heat Exchanger Fan Combination Foot Print View .................................53
Figure 18. Structure to Motherboard Interface.....................................................54
Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling
Feature...........................................................................................55
Figure 20. CPU Maximum Current Draw for Heat Exchanger Fan Speed...................56
Figure 21. Intel
®
Quiet System Technology Overview ...........................................58
Figure 22. PID Controller Fundamentals .............................................................59
Figure 23. Intel
®
Quiet System Technology Platform Requirements ........................60
Figure 24. Example Acoustic Fan Speed Control Implementation............................61
Figure 25. Digital Thermal Sensor and Thermistor................................................62
Figure 26. Board Deflection Definition ................................................................65
Figure 27. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........67
Figure 28. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ...70
Figure 29. Load Cell Installation in Machined Heatsink Base Pocket – Side View .......71
Figure 30. Preload Test Configuration.................................................................71
Figure 31. Omega Thermocouple.......................................................................79
Figure 32. 775-LAND LGA Package Reference Groove Drawing...............................80
Figure 33. IHS Groove on the 775-LAND LGA Package..........................................81
Figure 34. IHS Groove Orientation Relative to the LGA775 Socket..........................81
Figure 35. Inspection of Insulation on Thermocouple............................................82
Figure 36. Bending the Tip of the Thermocouple ..................................................83
Figure 37. Securing Thermocouple Wires with Kapton* Tape Prior to Attach ............83
Figure 38. Thermocouple Bead Placement...........................................................84
Figure 39. Position Bead on the Groove Step.......................................................85
Figure 44. Detailed Thermocouple Bead Placement ..............................................85
Figure 41. Third Tape Installation ......................................................................86
Figure 42. Measuring Resistance between Thermocouple and IHS ..........................86
Figure 43. Applying Flux to the Thermocouple Bead .............................................87
Figure 44. Cutting Solder .................................................................................87
Figure 45. Positioning Solder on IHS ..................................................................88
Figure 46. Solder Station Setup ........................................................................89
Figure 47. View Through Lens at Solder Station...................................................90
Figure 48. Moving Solder back onto Thermocouple Bead .......................................90
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
