Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
81
The orientation of the groove relative to the package pin 1 indicator (gold triangle in
one corner of the package) is shown. Figure 33 for the 775-Land LGA package IHS.
Figure 33. IHS Groove on the 775-LAND LGA Package
When the processor is installed in the LGA775 socket, the groove is perpendicular to
the socket load lever, and on the opposite side of the lever, as shown Figure 34.
Figure 34. IHS Groove Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of holding drawing specified tolerances. IHS
groove geometry is critical for repeatable placement of the thermocouple bead,
ensuring precise thermal measurements. The specified dimensions minimize the
impact of the groove on the IHS under the socket load. A larger groove may cause the
IHS to warp under the socket load such that it does not represent the performance of
an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Pin1
indicator
IHS Groove
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
