LGA775 Socket Heatsink Loading
66
Thermal and Mechanical Design Guidelines
A.2.3
Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL - d_ref
≥
0.09 mm and d_EOL - d_ref
≥
0.15 mm
And
d’_BOL – d’_ref
≥
0.09 mm and d_EOL’ – d_ref’
≥
0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.
A.2.4
Board Deflection Metric Implementation Example
This section is for illustration only, and relies on the following assumptions:
•
72 mm x 72 mm hole pattern of the reference design
•
Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep
over time
⎯
Though these values are representative, they may change with selected
material and board manufacturing process. Check with your motherboard
vendor.
•
Clip stiffness assumed constant – No creep.
Using Figure 27, the heatsink preload at beginning of life is defined to comply with
d_EOL – d_ref = 0.15 mm depending on clip stiffness assumption.
Note that the BOL and EOL preload and board deflection differ. This is a result of the
creep phenomenon. The example accounts for the creep expected to occur in the
motherboard. It assumes no creep to occur in the clip. However, there is a small
amount of creep accounted for in the plastic fasteners. This situation is somewhat
similar to the Intel Reference Design.
The impact of the creep to the board deflection is a function of the clip stiffness:
•
The relatively compliant clips store strain energy in the clip under the BOL preload
condition and tend to generate increasing amounts of board deflection as the
motherboard creeps under exposure to time and temperature.
•
In contrast, the stiffer clips store very little strain energy, and therefore does not
generate substantial additional board deflection through life.
NOTES:
1.
Board and clip creep modify board deflection over time and depends on board
stiffness, clip stiffness, and selected materials.
2.
Designers must define the BOL board deflection that will lead to the correct end
of life board deflection
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
