LGA775 Socket Heatsink Loading
50
Thermal and Mechanical Design Guidelines
The reservoir is located in the heat exchanger at its top as shown in Figure 15. An air
spring or an accumulator is needed to prevent high-pressure situation due to
operating or storage temperature changes. 8 mL air volume is provided on the top of
the reservoir to develop an air spring that minimizes the sensitivity to temperature
change on pump internal pressure.
Figure 15. Reservoir Location
5.2.3.3
Reliability Test Results
The reliability test results are summarized in Table 8. A small sample size was used to
evaluate design against reliability. Test results showed no assembly cracking failure in
either continuous operation or on-off cycles. The liquid loss measured was smaller
than the reservoir capability for either use condition. Thermal resistance showed
change of -0.01 to +0.007 ºC /W which is insignificant compared to the measurement
accuracy of approxi/- 0.01 ºC /W. The pump motor and PCB also did not
show significant RPM degradation. The pump internal mechanisms (e.g., corrosion)
that affect thermal performance were not expected to be active with the cycling use
condition only and so thermal performance after cycling test was not measured.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
