Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines
21
2.3.3
Thermal Interface Material
Thermal interface material application between the processor IHS and the heatsink
base is generally required to improve thermal conduction from the IHS to the
heatsink. Many thermal interface materials can be pre-applied to the heatsink base
prior to shipment from the heatsink supplier and allow direct heatsink attach, without
the need for a separate thermal interface material dispense or attach process in the
final assembly factory.
All thermal interface materials should be sized and positioned on the heatsink base in
a way that ensures the entire processor IHS area is covered. It is important to
compensate for heatsink-to-processor attach positional alignment when selecting the
proper thermal interface material size.
When pre-applied material is used, it is recommended to have a protective application
tape over it. This tape must be removed prior to heatsink installation.
2.4
System Thermal Solution Considerations
2.4.1
Chassis Thermal Design Capabilities
The Intel liquid cooling thermal solution assumes that chassis delivers a maximum T
A
at the inlet of the processor heat exchanger (refer to Section
5.1.1). Table 1 shows
the T
A
requirements for the ALCT and the similar BTX solutions.
Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
Topic
ATX ALCT
BTX Liquid Cooling
Heatsink Inlet
Temperature
38 °C
35.5 °C
2.4.2
Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements and structural
considerations that limit the thermal solution size. For more information, refer to the
ATX Thermal Design Suggestions or microATX Thermal Design Suggestions or
Balanced Technology Extended (BTX) System Design Guide v1.0 documents available
on the
http://www.formfactors.org/
web site.
In addition to passive heatsinks, fan heatsinks and system fans are other solutions
that exist for cooling integrated circuit devices. For example, ducted blowers, heat
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
