Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
89
Figure 46. Solder Station Setup
21.
Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note:
Do not touch the copper heater block at any time as this is very hot.
22.
Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
23.
Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded
Note:
The target IHS temperature during reflow is 150°C ±3°C. At no time should the IHS
temperature exceed 155 °C during the solder process as damage to the device may
occur.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
