Introduction
Thermal and Mechanical Design Guidelines
11
1.2
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Location
Intel
®
Core™2 Extreme Processor QX9000 Series and Intel
®
Core™2 Quad Processor Q9000 Series Datasheet
http://w.ww.intel.com/design/pro
cessor/datashts/318726.htm
Intel
®
Core™2 Extreme Quad-Core Processor QX6000
Δ
Sequence and Intel
®
Core™2 Quad Processor Q6000
Δ
Sequence
Datasheet
http://developer.intel.com/design
/processor/datashts/315592.htm
LGA775 Socket Mechanical Design Guide
http://intel.com/design/
Pentium4/guides/ 302666.htm
Fan Specification for 4-wire PWM Controlled Fans
http://www.formfactors.org/
ATX Thermal Design Suggestions
http://www.formfactors.org/
microATX Thermal Design Suggestions
http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide
http://www.formfactors.org/
1.3
Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan
inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the
topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
T
LIQUID
Working fluid temperature as it leaves the pump (or enters the heat exchanger).
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
Note:
Heat source must be specified for
Ψ
measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
C
– T
S
) / Total Package
Power.
Note:
Heat source must be specified for
Ψ
measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
A
) / Total Package Power.
Note:
Heat source must be specified for
Ψ
measurements.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
