Intel QX68000 Core 2 Extreme, Design Manual

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Thermal and Mechanical Design Guidelines 5
B.2.1 Heatsink Preparation................................................................69
B.2.2 Typical Test Equipment ............................................................72
B.3 Test Procedure Examples.......................................................................72
B.3.1 Time-Zero, Room Temperature Preload Measurement...................73
B.3.2 Preload Degradation under Bake Conditions ................................73
Appendix C Thermal Interface Management.........................................................................75
C.1 Bond Line Management .........................................................................75
C.2 Interface Material Area..........................................................................75
C.3 Interface Material Performance...............................................................75
Appendix D Case Temperature Reference Metrology..............................................................77
D.1 Objective and Scope .............................................................................77
D.2 Supporting Test Equipment....................................................................78
D.3 Thermal Calibration and Controls ............................................................79
D.4 IHS Groove .........................................................................................79
D.5 Thermocouple Attach Procedure .............................................................82
D.5.1 Thermocouple Conditioning and Preparation ................................82
D.5.2 Thermocouple Attachment to the IHS .........................................83
D.5.3 Solder Process ........................................................................88
D.5.4 Cleaning and Completion of Thermocouple Installation..................91
D.6 Thermocouple Wire Management ............................................................95
Appendix E Legacy Fan Speed Control ................................................................................97
E.1 Thermal Solution Design .......................................................................97
E.1.1 Determine Thermistor Set Points ...............................................97
E.1.2 Minimum Fan Speed Set Point ...................................................98
E.2 Board and System Implementation .........................................................99
E.2.1 Choosing Fan Speed Control Settings .........................................99
E.2.1.1 Temperature to Begin Fan Acceleration ...................... 100
E.2.1.2 Minimum PWM Duty Cycle........................................ 102
E.3 Combining Thermistor and Digital Thermal sensor Control ........................ 103
E.4 Interaction of Thermal Profile and T
CONTROL
............................................. 103
Appendix F BTX System Thermal Considerations................................................................ 109
Appendix G Mechanical Drawings ..................................................................................... 113
Appendix H Intel Enabled Reference Solution Information.................................................... 123