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LGA775 Socket Heatsink Loading

Thermal and Mechanical Design Guidelines

Table 10. Board Deflection Configuration Definitions

Configuration

Parameter

Pro Socket

load plate

Heatsink Parameter

Name

d_ref

yes

BOL deflection, no
preload

d_BOL

yes

BOL deflection with
preload

d_EOL yes yes

EOL

deflection

BOL: Beginning of Life

EOL: End of Life

Figure 26. Board Deflection Definition

d’1

d’2

Summary of Contents for QX68000 Core 2 Extreme

Page 1: ...2 Extreme Processor QX6800 and Intel Core 2 Extreme Processor QX9770 Thermal and Mechanical Design Guidelines For the Intel Core 2 Extreme Processor QX6800 B3 Stepping and the Intel Core 2 Extreme Pr...

Page 2: ...for the design sale and functionality of its product including any liability arising from product infringement or product warranty Intel provides this information for customer s convenience only Use a...

Page 3: ...0 2 3 3 Thermal Interface Material 21 2 4 System Thermal Solution Considerations 21 2 4 1 Chassis Thermal Design Capabilities 21 2 4 2 Improving Chassis Thermal Performance 21 2 4 3 Summary 22 2 5 Sys...

Page 4: ...Requirements 52 5 4 Safety Requirements 52 5 5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design 52 5 6 Reference Attach Mechanism 54 5 7 Socket and Voltage Regulation Cooling Strat...

Page 5: ...5 1 Thermocouple Conditioning and Preparation 82 D 5 2 Thermocouple Attachment to the IHS 83 D 5 3 Solder Process 88 D 5 4 Cleaning and Completion of Thermocouple Installation 91 D 6 Thermocouple Wire...

Page 6: ...Fan Speed 56 Figure 21 Intel Quiet System Technology Overview 58 Figure 22 PID Controller Fundamentals 59 Figure 23 Intel Quiet System Technology Platform Requirements 60 Figure 24 Example Acoustic Fa...

Page 7: ...3 116 Figure 69 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 1 117 Figure 70 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 2 118 Figure 71 Bal...

Page 8: ...ding 8 Thermal and Mechanical Design Guidelines Revision History Revision Number Description Revision Date 001 Initial release April 2007 002 Added Intel Core 2 Extreme processor QX9770 C0 Stepping Ed...

Page 9: ...he processor thermal solution All of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density more transistors As operating freq...

Page 10: ...ity the specific processor datasheet will be referenced Chapter 2 of this document discusses package thermal mechanical requirements to design a thermal solution for the processor in the context of pe...

Page 11: ...be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink TC The case temperature of the processor measured at the geometric center of the topside of the IHS TE The am...

Page 12: ...specifications TCC Thermal Control Circuit Thermal Monitor uses the TCC to reduce die temperature by lowering effective processor frequency when the die temperature has exceeded its operating limits...

Page 13: ...ty in the center of the socket with solder balls for surface mounting to the motherboard The socket is named LGA775 socket A description of the socket can be found in the LGA775 Socket Mechanical Desi...

Page 14: ...moval mechanical stress testing and standard shipping conditions When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink base a...

Page 15: ...therboard and the system have to be considered when designing the heatsink attach mechanism Their design should provide a means for protecting LGA775 socket solder joints The Intel ALCT reference desi...

Page 16: ...installed into the chassis Minimizes contact with the motherboard surface during installation and actuation to avoid scratching the motherboard 2 2 Thermal Requirements Refer to the datasheet for the...

Page 17: ...tive liquid cooled design should be designed to manage the heat exchanger inlet temperature of 35 C 3 C 38 C see Chapter 5 For BTX platforms the similar BTX liquid cooling design should be designed to...

Page 18: ...e for the processor is relative to the Thermal Control Circuit TCC activation set point which will be seen as 0 via the digital thermometer As a result the TCONTROL value will always be a negative num...

Page 19: ...fins directly impact the thermal performance of the heatsink In particular the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution...

Page 20: ...TX motherboard keep out footprint definition and height restrictions for enabling components defined for the platforms designed with the LGA775 socket in Appendix G of this design guide The motherboar...

Page 21: ...rements for the ALCT and the similar BTX solutions Table 1 Heatsink Inlet Temperature of Intel Reference Thermal Solutions Topic ATX ALCT BTX Liquid Cooling Heatsink Inlet Temperature 38 C 35 5 C 2 4...

Page 22: ...is a function of chassis design The thermal design power TDP of the processor and the corresponding maximum TC as calculated from the thermal profile These parameters are usually combined in a single...

Page 23: ...utions in identical situations same heat source and local ambient conditions The thermal characterization parameter is calculated using total package power Note Heat transfer is a three dimensional ph...

Page 24: ...ient C W CS is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and IHS SA is a measure of the thermal characterization parameter from the bottom of the hea...

Page 25: ...xample power and temperature numbers used here are not related to any specific Intel processor thermal specifications and are for illustrative purposes only Assume the TDP as listed in the datasheet i...

Page 26: ...anger It is worthwhile to determine the local ambient temperature in the chassis around the processor to understand the effect it may have on the case temperature TA is best measured by averaging temp...

Page 27: ...thermocouples should be placed approximately 13 mm to 25 mm 0 5 to 1 0 in away from processor and heatsink as shown in Figure 7 The thermocouples should be placed approximately 51 mm 2 0 in above the...

Page 28: ...mbient Temperature Liquid Cooling Heat Exchanger NOTE Drawing Not to Scale Figure 7 Locations for Measuring Local Ambient Temperature Passive Heatsink NOTE Drawing Not to Scale Fa n I O VR Fan Hub Spo...

Page 29: ...nd the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient a...

Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...

Page 31: ...nt feature called Thermal Monitor is available on the processor It provides a thermal management approach to support the continued increases in processor frequency and performance By using a highly ac...

Page 32: ...g PROCHOT pulled low or FORCEPR which activates the TCC the VR can cool down as a result of reduced processor power consumption Bi directional PROCHOT can allow VR thermal designs to target maximum su...

Page 33: ...ch consisting of a specific operating frequency and voltage The first operating point represents the normal operating condition for the processor The second operating point consists of both a lower op...

Page 34: ...e BIOS must enable the Thermal Control Circuit Thermal Monitor must be enabled to ensure proper processor operation The Thermal Control Circuit feature can be configured and monitored in a number of w...

Page 35: ...the clocks are enabled is adjusted to achieve the desired ratio For example if the clock disable period is 3 s and a duty cycle of 25 is selected the clock on time would be reduced to approximately 1...

Page 36: ...ts are active at all times 4 2 8 THERMTRIP Signal In the event of a catastrophic cooling failure the processor will automatically shut down when the silicon temperature has reached its operating limit...

Page 37: ...model for TCONTROL with the DTS is the same as with the on die thermal diode If the Digital Thermometer is less than TCONTROL the fan speed can be reduced If the Digital Thermometer is greater than o...

Page 38: ...mitted For an overview of the PECI interface see PECI Feature Set Overview For additional information on the PECI see the processor datasheet The PECI bus is available on pin G5 of the LGA 775 socket...

Page 39: ...ings The seal is a function of the molding process The copper cold plate is molded into the lower housing The metal to plastic seal is also a function of the molding process The unit is maintenance fr...

Page 40: ...s in processor utilization and ambient air conditions The required fan speed necessary to meet thermal specifications can be controlled by the silicon sensor temperature and should comply with require...

Page 41: ...degradation in thermal solution performance compared to what is obtained at sea level with lower fan performance and higher surface temperatures The system designer needs to account for altitude effe...

Page 42: ...or logic low VIL 0 8 V PWM compliant function RPM must be within spec for specified duty cycle In addition to comply with overall thermal requirements see Section 5 1 1 and the general environmental r...

Page 43: ...revolution Tachometer output signal Open collector open drain Tachometer output signal current sink capability 10 mA PWM signal input frequency 25 kHz nominal 21 kHz to 28kHz allowable range PWM sign...

Page 44: ...The thermal solution should meet the specified thermal performance targets after these tests are conducted however the test conditions outlined here may differ from your own system requirements 5 2 1...

Page 45: ...Time milliseconds A c c e l e r a t i o n g 5 2 1 2 1 Recommended Test Sequence Each test sequence should start with components i e motherboard heatsink assembly etc that have never been previously su...

Page 46: ...at TDP Thermal Test Vehicle refer to Section Error Reference source not found is used for this test 5 2 3 Reliability Testing The ALCT solution is a complex assembly with multiple joints and injection...

Page 47: ...g at TA 38 C TDP 130 W and HX 0 05 C W gives TLIQUID 45 C The calculated TLIQUID when fan is at its low speed and TA 26 C is expected to be approximately the same A typical on off cycle can be assumed...

Page 48: ...ALCT Material parameters are 3 8 internal diameter and 5 8 outer diameter 1 8 wall thickness Table 7 The Weekly Loss Rate of Different Tubing Materials Tubing Material Loss Rate grams week Polyurethe...

Page 49: ...the increment of 5 mL and measuring thermal performance at each increment The Thermal resistance data are shown in Figure 14 It can be seen that when the liquid of 65 mL or more is drawn thermal resis...

Page 50: ...ity test results are summarized in Table 8 A small sample size was used to evaluate design against reliability Test results showed no assembly cracking failure in either continuous operation or on off...

Page 51: ...ation for 0 3 samples 5 2 4 Recommended BIOS CPU Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses with the thermal mechanical enabl...

Page 52: ...ertification All mechanical and thermal enabling components must have CSA certification All components in particular the heatsink fins must meet the test requirements of UL1439 for sharp edges If the...

Page 53: ...n Thermal and Mechanical Design Guidelines 53 Figure 16 Intel ALCT Reference Design Major Components Development vendor information for the Intel ALCT Reference Solution is provided in Appendix A Figu...

Page 54: ...e stiffener plate requires removal After installation of the board into the chassis the pump and upper structure are secured to the motherboard and backside stiffener with two additional screws Figure...

Page 55: ...w a small gap or exit between the fan s pressure side and the heat exchanger inlet that is integrated into the heat exchanger design allows for air to be introduced directly to the VR region for cooli...

Page 56: ...lity of over 20 A at 100 speed over not having this feature Figure 20 CPU Maximum Current Draw for Heat Exchanger Fan Speed CPU maximum current draw capability at 35C external ambient 100 110 120 130...

Page 57: ...iscussion of programming the Intel QST in the ME please consult the Intel Quiet System Technology Intel QST Configuration and Tuning Manual 6 1 Intel Quiet System Technology Algorithm The objective of...

Page 58: ...low the magnitude of fan response to be determined based upon the difference between current temperature readings and specific temperature targets A major advantage of a PID Algorithm is the ability t...

Page 59: ...imit temperatures are assigned for each temperature sensor For Intel QST the TCONTROL for the processor and chipset are to be used as the limit temperature The ME will measure the error slope and rate...

Page 60: ...and 2 MB reserved for Intel QST FW execution SPI Flash with sufficient space for the Intel QST Firmware SST based thermal sensors to provide board thermal data for Intel QST algorithms Intel QST firmw...

Page 61: ...Core 2 Duo processor With the proper configuration information the ME can accommodate inputs from PECI or SST for the processor socket Additional SST sensors can be added to monitor system thermal se...

Page 62: ...n Intel QST and the thermistor but they can work in tandem to provide the maximum fan speed reduction The BTX reference design includes a thermistor on the fan hub This Variable Speed Fan curve will d...

Page 63: ...nd TIM performance LGA775 socket requires a minimum heatsink preload to protect against fatigue failure of socket solder joints Solder ball tensile stress is originally created when after inserting a...

Page 64: ...matching of Faxial required to protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection Therefore the heatsink preload for LGA775 socket solder j...

Page 65: ...Configuration Definitions Configuration Parameter Processor Socket load plate Heatsink Parameter Name d_ref yes no BOL deflection no preload d_BOL yes yes BOL deflection with preload d_EOL yes yes EOL...

Page 66: ...ng of life is defined to comply with d_EOL d_ref 0 15 mm depending on clip stiffness assumption Note that the BOL and EOL preload and board deflection differ This is a result of the creep phenomenon T...

Page 67: ...to deflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip assembly As a result designs could see as...

Page 68: ...ike Board bending during shock Board creep with high heatsink preload However the load required to meet the board deflection recommendation refer to Section A 2 3 with a very stiff board may lead to h...

Page 69: ...in Section B 2 2 To install the load cells machine a pocket in the heatsink base as shown Figure 28 and Figure 29 The load cells should be distributed evenly as close as possible to the pocket walls A...

Page 70: ...gn is Machine the pocket in the heat sink base to a depth such that the tips of the load cells are just flush with the heat sink base Then machine back the heatsink base by around 0 25 mm 0 01 so that...

Page 71: ...eatsink Base Pocket Side View Figure 30 Preload Test Configuration Load Cells 3x Preload Fixture copper core with milled out pocket Wax to maintain load cell in position during heatsink installation L...

Page 72: ...o automate data recording and control with a 6101 PCI card GPIB added to the scanner allowing it to be connected to a PC running LabVIEW or Vishay s StrainSmart software 4 IMPORTANT In addition to jus...

Page 73: ...e to allow the load cell to settle is generally specified by the load vendors often of order of 3 minutes The time zero reading should be taken at the end of this settling time 5 Record the preload me...

Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...

Page 75: ...a do not translate to a measurable improvement in thermal performance C 3 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heat...

Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...

Page 77: ...efines a reference procedure for attaching a thermocouple to the IHS of a 775 land LGA package for TC measurement This procedure takes into account the specific features of the 775 land LGA package an...

Page 78: ...AG 0 010 Diameter 52124 Flux Indium Corp of America 5RMA Loctite 498 Adhesive Super glue w thermal characteristics 49850 Adhesive Accelerator Loctite 7452 for fast glue curing 18490 Kapton Tape For ho...

Page 79: ...80 C using an appropriate temperature source Wire gauge and length also should be considered as some less expensive measurement systems are heavily impacted by impedance There are numerous resources...

Page 80: ...Case Temperature Reference Metrology 80 Thermal and Mechanical Design Guidelines Figure 32 775 LAND LGA Package Reference Groove Drawing...

Page 81: ...r as shown Figure 34 Figure 34 IHS Groove Orientation Relative to the LGA775 Socket Select a machine shop that is capable of holding drawing specified tolerances IHS groove geometry is critical for re...

Page 82: ...D 5 1 Thermocouple Conditioning and Preparation 1 Use a calibrated thermocouple as specified in Sections D 2 and D 3 2 Under a microscope verify the thermocouple insulation meets the quality requireme...

Page 83: ...groove and IHS with Isopropyl Alcohol IPA and a lint free cloth removing all residues prior to thermocouple attachment 7 Place the thermocouple wire inside the groove letting the exposed wire and bead...

Page 84: ...thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS Figure 38 A and B Figure 38 Thermocouple Bead Placement A B 10 Place the package under the m...

Page 85: ...ead using the tweezers or your finger Place a piece of Kapton tape to hold the wire inside the groove Figure 39 Refer to Figure 40 for detailed bead placement Figure 39 Position Bead on the Groove Ste...

Page 86: ...41 This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process 13 Measure resistance from thermocouple end wires hold both wires to...

Page 87: ...uple bead Be careful not to move the thermocouple bead during this step Figure 43 Ensure the flux remains in the bead area only Figure 43 Applying Flux to the Thermocouple Bead 15 Cut two small pieces...

Page 88: ...step 2 to ensure the bead is still properly contacting the IHS D 5 3 Solder Process 18 Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block Connect t...

Page 89: ...e Do not touch the copper heater block at any time as this is very hot 22 Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt 23 Lo...

Page 90: ...ed to move the solder back toward the groove as the IHS begins to heat Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up Figure 47 and Figure 48 Fig...

Page 91: ...re with a handheld meter until it drops below 50 C before moving it to the microscope for the final steps D 5 4 Cleaning and Completion of Thermocouple Installation 27 Remove the device from the solde...

Page 92: ...blade carefully shave the excess solder above the IHS surface Only shave in one direction until solder is flush with the groove surface Figure 51 Figure 51 Removing Excess Solder Note Take usual preca...

Page 93: ...e Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove Figure 52 Figure 52 Filling Groove with Adhesive 32 To speed up the curing proce...

Page 94: ...This will help to keep the adhesive surface flat and smooth with no pits or voids If there are voids in the adhesive refill the voids with adhesive and shave a second time 34 Clean IHS surface with IP...

Page 95: ...ulting reading maybe wrong For example if there are any cuts into the wires insulation where the wires are pinched between the IHS and the load plate the thermocouple wires can get in contact at this...

Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...

Page 97: ...n that meets the thermal profile for the processor See Section 2 2 2 for the definition of the thermal profile and consult the processor datasheet for the specific values The designer needs to ensure...

Page 98: ...e regulator or by functional limits of the fan design Per the Fan Specification for 4 wire PWM Controlled Fans there are three possible options to consider Type A The fan will run at minimum RPM for a...

Page 99: ...tionality embedded Intel has engaged with a number of major manufacturers of FSC components to provide devices that have a PECI host controller Please contact your Intel Field Sales representative for...

Page 100: ...igner might initially consider a small temperature range TCONTROL TLOW TRANGE 5 C to accelerate the fan That would delay the fan accelerating for the longest time after an increase in TSENSOR There ar...

Page 101: ...Fan speed oscillation are significantly reduced Maximum fan speed is lower The rate of change of CA vs RPM is an exponential curve with a larger decrease at the beginning of the fan acceleration than...

Page 102: ...ded For BTX Boxed Processor enabled reference solutions TRANGE value of 7 C is recommended E 2 1 2 Minimum PWM Duty Cycle The final step in determining the FSC setting is to determine the minimum PWM...

Page 103: ...in Operating Variable Speed Fan VSF Curve Fan Speed Operating Range with FSC 34 Min Fan Speed PWM Duty Cycle 100 Fan Speed RPM Inlet Temperature C Full Speed 30 38 Min Operating Variable Speed Fan VSF...

Page 104: ...al thermal sensor TLOW The temperature above which the fan will begin to accelerate in response to the digital thermal sensor temperature Hysteresis The number of degrees below TCONTROL the fans will...

Page 105: ...urement capability required Must support PECI and thermal diode via an SST device External remote thermal sensor sampling rate 4 times per second required External remote diode measurement SST device...

Page 106: ...d control these setting should not be user configurable 4 If this function is present on the device it must be enabled Table 14 BTX Fan Speed Control Settings Parameter Classification Processor Therma...

Page 107: ...ems a second thermal sensor is recommended to capture chassis ambient for more detail see Appendix F 6 To ensure compliance with the thermal specification thermal profile and usage of the TSENSOR for...

Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...

Page 109: ...useful to monitor the temperature near the PSU airflow inlet near the graphics add in card or near memory The final system integrator is typically responsible for ensuring compliance with the compone...

Page 110: ...llowing thermal sensor or its equivalent can be used for this function Part Number C83274 002 BizLink USA Technology Inc 44911 Industrial Drive Fremont CA 94538 USA 510 252 0786 phone 510 252 1178 fax...

Page 111: ...BTX System Thermal Considerations Thermal and Mechanical Design Guidelines 111 Figure 65 Thermal sensor Location Illustration TMA Airflow Thermal Sensor MCH Heatsink...

Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...

Page 113: ...Sheet 1 114 ATX ATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 115 ATX ATX Motherboard Keep out Footprint Definition and Height Restrictions for...

Page 114: ...MPONENT HEIGHT BOARD ROUTING KEEP OUT SHEET 1 OF 3 DO NOT SCALE DRAWING SCALE NONE 3 C40819 D REV DRAWING NUMBER CAGE CODE SIZE LGA775 microATX COMPONENT KEEP INS TITLE 2200 MISSION COLLEGE BLVD P O B...

Page 115: ...DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION 4X 6 00 4X 10 00 LEGEND COMPONENT KEEP OUT ROUTING KEEP OUT SHEET 2 OF 3 DO NOT SCALE DRAWING SCAL...

Page 116: ...D REV DRAWING NUMBER CAGE CODE SIZE DEPARTMENT C40819 3 3 DWG NO SHT REV LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLATE NOTES 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF S...

Page 117: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 117 Figure 69 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 1...

Page 118: ...Mechanical Drawings 118 Thermal and Mechanical Design Guidelines Figure 70 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 2...

Page 119: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 119 Figure 71 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 3...

Page 120: ...Mechanical Drawings 120 Thermal and Mechanical Design Guidelines Figure 72 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 4...

Page 121: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 121 Figure 73 Balanced Technology Extended BTX Thermal Module Keep Out Volumetric Sheet 5...

Page 122: ...Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 74 Intel Advanced Liquid Cooling Technology Assembly...

Page 123: ...able 16 lists suppliers that produce Intel enabled reference components The part numbers listed below identifies these reference components End users are responsible for the verification of the Intel...

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