Intel Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines
49
Figure 13. The Assembly Cumulative Mass Loss Data in Continuous Operation Test at
50 ºC and 1450 RPM
0.0
0.5
1.0
1.5
2.0
2.5
0
2
4
6
8
Week
C
u
m
u
la
tive ma
s
s
lo
s
s
(g
ra
ms
)
Pump-1
Pump-2
Pump-3
The reservoir presence in assembly and its impact on thermal performance was also
confirmed by drawing the liquid out in the increment of 5 mL and measuring thermal
performance at each increment. The Thermal resistance data are shown in Figure 14.
It can be seen that when the liquid of 65 mL or more is drawn, thermal resistance
goes up significantly. The test verifies the role of reservoir in maintaining thermal
performance with liquid loss up to the reservoir size of 38 mL and 27 mL beyond that.
Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir
Theta ca vs. fluid level
0.000
0.200
0.400
0.600
0.800
1.000
1.200
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Fluid Removed [ml]
T
h
et
a ca [
C
/W
]
Pump-1
Pump 3
Pump 2
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
