Thermal and Mechanical Design Guidelines
3
Contents
1
Introduction .....................................................................................................9
1.1
Document Goals and Scope .....................................................................9
1.1.1
Importance of Thermal Management ............................................9
1.1.2
Document Goals........................................................................9
1.1.3
Document Scope .....................................................................10
1.2
References ..........................................................................................11
1.3
Definition of Terms ...............................................................................11
2
Processor Thermal/Mechanical Information .........................................................13
2.1
Mechanical Requirements ......................................................................13
2.1.1
Processor Package...................................................................13
2.1.2
Heatsink Attach ......................................................................15
2.1.2.1
General Guidelines....................................................15
2.1.2.2
The Pump Assembly Clip Load Requirement..................15
2.1.2.3
Additional Guidelines.................................................16
2.2
Thermal Requirements ..........................................................................16
2.2.1
Processor Case Temperature .....................................................16
2.2.2
Thermal Profile .......................................................................17
2.2.3
T
CONTROL
..................................................................................18
2.3
Heatsink Design Considerations..............................................................19
2.3.1
Heatsink Size..........................................................................20
2.3.2
Package IHS Flatness...............................................................20
2.3.3
Thermal Interface Material........................................................21
2.4
System Thermal Solution Considerations .................................................21
2.4.1
Chassis Thermal Design Capabilities...........................................21
2.4.2
Improving Chassis Thermal Performance ....................................21
2.4.3
Summary...............................................................................22
2.5
System Integration Considerations..........................................................22
3
Thermal Metrology ..........................................................................................23
3.1
Characterizing Cooling Performance Requirements ....................................23
3.1.1
Example ................................................................................25
3.2
Processor Thermal Solution Performance Assessment ................................26
3.3
Local Ambient Temperature Measurement Guidelines.................................26
3.4
Processor Case Temperature Measurement Guidelines ...............................29
4
Thermal Management Logic and Thermal Monitor Feature .....................................31
4.1
Processor Power Dissipation...................................................................31
4.2
Thermal Monitor Implementation ............................................................31
4.2.1
PROCHOT# Signal ...................................................................32
4.2.2
Thermal Control Circuit ............................................................32
4.2.3
Thermal Monitor 2 ...................................................................33
4.2.4
Operation and Configuration .....................................................34
4.2.5
On-Demand Mode ...................................................................35
4.2.6
System Considerations.............................................................35
4.2.7
Operating System and Application Software Considerations ...........36
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
