Case Temperature Reference Metrology
94
Thermal and Mechanical Design Guidelines
Figure 54. Removing Excess Adhesive from IHS
33.
Using a blade, carefully shave any adhesive that is above the IHS surface
(Figure 54). The preferred method is to shave from the edge to the center of the
IHS.
Note:
The adhesive shaving step should be performed while the adhesive is partially cured,
but still soft. This will help to keep the adhesive surface flat and smooth with no pits
or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a
second time.
34.
Clean IHS surface with IPA and a wipe.
35.
Clean the LGA pads with IPA and a wipe.
36.
Replace the land side cover on the device.
37.
Perform a final continuity test.
38.
Wind the thermocouple wire into loops and secure or if provided by the vendor
back onto the plastic roll. (Figure 55).
Figure 55. Finished Thermocouple Installation
39.
Place the device in a tray or bag until it’s ready to be used for thermal testing use.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
