LGA775 Socket Heatsink Loading
54
Thermal and Mechanical Design Guidelines
5.6
Reference Attach Mechanism
The ALCT pump is attached to the motherboard through the use of a backside stiffener
plate. Prior to motherboard installation in the chassis the backside stiffener plate is
attached with two screws. Once installed these screws remain installed unless the
stiffener plate requires removal. After installation of the board into the chassis the
pump and upper structure are secured to the motherboard and backside stiffener with
two additional screws (Figure 18). The heat exchanger is positioned on the back
panel and is secured in place using four screws provided in the accessory kit. The
heat exchanger can be mounted on most back panels that will accept 120 mm fans.
The range of recommended positions of the heat exchanger relative to the pump is
defined in Figure 74.
Figure 18. Structure to Motherboard Interface
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
