Intel Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines
51
Table 8. Reliability Test Results
Use
Condition
Test Conditions
Failure
mechanism
Results
T
LIQUID
= 75 ºC
for 16 weeks
1 0/10
failure
T
LIQUID
= 50 ºC
2
0.25-0.30 grams/week
T
LIQUID
= 50 ºC
3
Insignificant change in
Ψ
ca for 3
samples
Continuous
Operation
T
LIQUID
= 50 ºC
4
2% average RPM degradation after 8
weeks for 3 samples
T
LIQUID
= 35-60 ºC,
5500 cycles
1 0/3
failure
T
LIQUID
= 35-60 ºC,
5500 cycles
2
3 grams loss after all cycles for 3
samples
On-off
Cycles
T
LIQUID
= 35-60 ºC,
7500 cycles
4
No RPM degradation for 0/3 samples
5.2.4
Recommended BIOS/CPU/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational motherboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
•
Appropriate system motherboard
•
Processor
•
All enabling components, including socket and thermal solution parts
•
Power supply
•
Disk drive
•
Video card
•
DIMM
•
Keyboard
•
Monitor
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
