Case Temperature Reference Metrology
88
Thermal and Mechanical Design Guidelines
16.
Place the two pieces of solder in parallel, directly over the thermocouple bead
(Figure 45)
Figure 45. Positioning Solder on IHS
17.
Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section
D.5.1, step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3
Solder Process
18.
Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature
19.
Verify the temperature of the Heater block station has reached 155°C ±5°C before
you proceed.
20.
Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
Summary of Contents for QX68000 Core 2 Extreme
Page 30: ...LGA775 Socket Heatsink Loading 30 Thermal and Mechanical Design Guidelines...
Page 74: ...Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines...
Page 76: ...Thermal Interface Management 76 Thermal and Mechanical Design Guidelines...
Page 96: ...Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines...
Page 108: ...Legacy Fan Speed Control 108 Thermal and Mechanical Design Guidelines...
Page 112: ...BTX System Thermal Considerations 112 Thermal and Mechanical Design Guidelines...
