UM10208_2
© NXP B.V. 2007. All rights reserved.
User manual
Rev. 02 — 1 June 2007
312 of 362
1.
Features
•
TFBGA180 package: Plastic low-profile ball grid array, 180 balls, 10 x 10 x 0.8 MM.
•
81 pins have dual use General Purpose I/O or “functional” I/O, plus 4 dedicated GPIO.
•
Each dual use pin can be programmed for functional I/O, drive high, drive low, or
hi-Z/input.
•
4 pins dedicated General Purpose I/O, programmable for drive high, drive low, or
hi-Z/input.
2.
Pinning
2.1 Pin descriptions by module
lists all 180 pins of the LPC288x, organized by the functional block to which
each pin relates. The functional blocks are listed alphabetically, except that digital supply
pins are last. Within each functional block, pins are listed alphabetically within each of the
following pin types:
1. inputs and input/outputs,
2. output pins,
3. reference voltages, and
4. supply pins.
UM10208
Chapter 25: LPC2800 pinning
Rev. 02 — 1 June 2007
User manual
Table 362. Pin descriptions (by module)
Signal name
Ball #
Type
Description
Analog in (dual converter)
AINL
T4
I
analog L input channel
AINR
T1
I
analog R input channel
VCOM(DADC)
T3
RV
ADC common reference voltage and analog output reference voltage
combined on-chip
VREF(DADC)
U1
RV
ADC reference voltage
VREFN(DADC)
V1
RV
ADC negative reference voltage
VREFP(DADC)
U2
RV
ADC positive reference voltage
V
DD(DADC1V8)
V3
P
1.8 V for dual ADC
V
DD(DADC3V3)
U3
P
3.3 V for dual ADC
V
SS(DADC)
V2
P
ground for dual ADC