Package Information
© 2010 Advanced Micro Devices, Inc.
47062 SR5650 Databook 2.00
Proprietary
5-7
Figure 5-4 RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile
50
250
150
200
100
Soldering Zone
45 - 90 sec. Max.
60 - 80 sec. typical
Peak Temp. (235
o
C
+/-5% typ., 245
o
C
max
.)
220 deg.C
60 – 80 sec. typical
<2.0
o
C / Sec.
<2.0
o
.C / Sec.
2 min to 4 min Max.
Heating Time
Solder/Part Surface Temp. (
o
C
)
Pre-heating Zone
Soaking Zone
130
o
C
170
o
C
60 – 120 sec. max