47062 SR5650 Databook 2.00
© 2010 Advanced Micro Devices, Inc.
5-2
Proprietary
SR5650 Thermal Characteristics
5.2
SR5650 Thermal Characteristics
This section describes some key thermal parameters of the SR5650. For a detailed discussion on these parameters and
other thermal design descriptions, including package level thermal data and analysis, please consult the
Thermal Design
and Analysis Guidelines for SR5650/5670/5690,
order# 44382.
5.2.1
SR5650 Thermal Limits
V
IMAX
Absolute Max Input Voltage
-
+1.15
V
V
IMIN
Absolute Min Input Voltage
-
-0.15
V
Table 5-3 DC Characteristics for 1.8V GPIO Pads
Symbol
Description
Minimum Maximum
Unit
Notes
V
IH-DC
Input High Voltage
1.1
-
V
1
V
IL-DC
Input Low Voltage
-
0.7
V
1
V
OH
Minimum Output High Voltage @ I=8mA
1.4
-
V
2, 3
V
OL
Maximum Output Low Voltage @ I=8mA
-
0.4
V
2, 3
I
OL
Minimum Output Low Current @ V=0.1V
2.0
-
mA
2, 3
I
OH
Minimum Output High Current @ V=VDDR-0.1V
2.0
-
mA
2, 3
Notes:
1) Measured with edge rate of 1us at PAD pin.
2) For detailed current/voltage characteristics please refer to IBIS model.
3) Measurement taken with SP/SN set to default values, PVT=Noml Case
Table 5-4 DC Characteristics for the HyperTransport™ 100MHz Differential Clock (HT_REFCLK)
Symbol
Description
Minimum
Typical
Maximum
Comments
V
IL
Input Low Voltage
–
0V
0.2V
–
V
IH
Input High Voltage
1.4V
1.8V
–
–
V
IMAX
Maximum Input Voltage
–
–
2.1V
–
Table 5-5 SR5650 Thermal Limits
Parameter
Minimum
Nominal
Maximum
Unit
Note
Operating Case Temperature
0
—
95
°
C
1
Absolute Rated Junction
Temperature
—
—
115
°
C
2
Storage Temperature
-40
—
60
°
C
Ambient Temperature
0
—
55
°
C
3
Thermal Design Power
—
12.6
—
W
4
Notes:
1 - The maximum operating case temperature is the die top-center temperature measured via a thermocouple based on the
methodology given in the document
Thermal Design and Analysis Guidelines for SR5650/5670/5690
(Chapter 12). This is the
temperature at which the functionality of the chip is qualified.
2 - The maximum absolute rated junction temperature is the junction temperature at which the device can operate without causing
damage to the ASIC.
3 - The ambient temperature is defined as the temperature of the local intake air at the inlet to the thermal management device. The
maximum ambient temperature is dependent on the heat sink design, and the value given here is based on AMD’s reference heat sink
solution for the SR5650. Refer to Chapter 6 in
Thermal Design and Analysis Guidelines for SR5650/5670/5690
for heatsink and thermal
design guidelines. Refer to Chapter 7 for details of ambient conditions.
4 - Thermal Design Power (TDP) is defined as the highest power dissipated while running currently available worst case applications at
nominal voltages. The core voltage was raised to 5% above its nominal value for measuring the ASIC power. Since the core power of
modern ASICs using 65nm and smaller process technology can vary significantly, parts specifically screened for higher core power were
used for TDP measurement. The TDP is intended only as a design reference, and the value given here is preliminary.
Symbol
Description
Minimum
Maximum
Unit