Package Information
© 2010 Advanced Micro Devices, Inc.
47062 SR5650 Databook 2.00
Proprietary
5-5
Figure 5-3 SR5650 Ball Arrangement (Bottom View)
5.3.1
Pressure Specification
To avoid damages to the ASIC (die or solder ball joint cracks) caused by improper mechanical assembly of the cooling
device, follow the recommendations below:
•
It is recommended that the maximum load that is evenly applied across the contact area between the thermal
management device and the die does not exceed 6 lbf. Note that a total load of 4-6 lbf is adequate to secure the
thermal management device and achieve the lowest thermal contact resistance with a temperature drop across
the thermal interface material of no more than 3°C. Also, the surface flatness of the metal spreader should be
0.001 inch/1 inch.
•
Pre-test the assembly fixture with a strain gauge to make sure that the flexing of the final assembled board and
the pressure applying around the ASIC package will not exceed 600 micron strain under any circumstances.
ddd
-
-
0.20
Note:
Maximum height of SMT components is 0.650 mm.
Table 5-6 SR5650 692-Pin FCBGA Package Physical Dimensions
Ref.
Min. (mm)
Typical (mm)
Max. (mm)