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System Manual
Oxford Instruments Plasma Technology
OpAL
3.1
Introduction
The
OpAL
system is an Atomic Layer Deposition (ALD) system, which can be configured to
carry out thermal (ALD) and plasma enhanced (PEALD).
A large range of options is available to precisely tailor the system to the customer's
requirements.
The
OpAL
system is supplied in a two-console configuration sharing various system
components.
A stainless steel cabinet with removable access panels encloses the mechanical and
electronic components of the system and provides a support for the processing chamber.
Pumps such as the rotary vane pump are mounted separately from the main console
cabinet. Precursors are housed inside an extractable enclosure bolted to the main
console.
The upper chamber and integral inductively coupled plasma components are raised and
rotated clear of the chamber base and substrate table by a pneumatic hoist mechanism.
This provides access to the table for loading and removal of substrates. The hoist is, for
safety considerations, operated by pressing two buttons simultaneously.
The lower aluminium chamber is sited on PEEK standoffs from the frame. The CM gauge
and N2 vent are fitted to the pumping elbow which is fitted to the lower chamber. Process
gases including ALD precursors are supplied to the substrate via channels in the two
halves of the chamber.
The substrate table is made of aluminium for temperatures up to 400ºC.
Description
Printed: 07 August 2009 07:42
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Issue 1: August 07
Summary of Contents for OpAL
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