Intel® Server System M50FCP1UR System Integration and Service Guide
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The procedures described in the following sections must be followed in the order specified to assemble the
PHM and install it to the server board. These instructions assume that all PHM components are new, and the
Thermal Interface Material (TIM) is already applied to the bottom of the heat sink.
2.3.1
Processor Heat Sink Module (PHM) Assembly
Caution:
Wear ESD gloves to prevent electrostatic damage and oxidation or foreign material on processor
package and land pads.
Note:
Installation procedures in the following sections apply to both types of processor heat sink. Steps
unique to one heat sink type will be identified.
Figure 12. Installing Processor Carrier Clip onto Processor–Part 1
1.
Position the Pin 1 indicator of the carrier clip with the Pin 1 indicator of the processor (See
Figure 12
).
2.
With the processor still on its shipping tray, place the processor carrier clip over the processor.
Figure 13. Installing Processor Carrier Clip onto Processor–Part 2
3.
Gently press down on two opposite sides at a time of the processor carrier clip until it clicks in place.
Summary of Contents for M50FCP1UR
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